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PM5389 WSE 20 SONET/SDH Wideband Cross-Connect Short Form Data Sheet [54 KB] PMC-2031810 | 4 | 2004-09-23 |
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WSE 20 ASSP Telecom Standard Product Data Sheet [1.67 MB] PMC-2041839 | 3 | 2007-01-02 |
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Attaching Passive Heat Sinks to Organic Flip Chip Packages [142 KB] PMC-2020246 | 3 | 2007-05-02 |
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Optimizing Pre-emphasis and Receive Equalization for Backplanes [493 kB] PMC-2021098 | 1 | 2002-10-31 |
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Application of Message Assisted Protection Switching (MAPS) to APS Architectures [402 KB] PMC-2021902 | 3 | 2003-09-22 |
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Notice of Change - All FCBGA Packages to be Standardized to the HDBU Substrate Package Outline [695 KB] PMC-2062178 | 1 | 2006-10-19 |
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PM5389-FI WSE 20 672 FCBGA CAD Symbols and Footprints [327 KB] PMC-2052241 | 2 | 2006-02-20 |
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RASIO 3G for SONET/SDH Backplanes Technology Brief [64 kB] PMC-2030933 | 1 | 2003-05-29 |