Product Overview

Features

  • Implements a 185G memory switch fabric with STS-1/AU-3 switching granularity.
  • 74 ingress and 74 egress STS-48/STS-12 ports for a maximum of 3552 STS-1/AU-3 streams in a single device.
  • Supports a single-stage, anycast switching capacity of 185G.

    • Typical Applications include:

  • SDH/SONET ADM
  • MSPP
  • Terminal Multiplexers
  • Digital Cross-Connects

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    Product Brief
          Version Issue Date
    Locked PDF Document PM5308 TSE 120 Single Chip 74-Port STS-1/STM-0 Cross-Connect Product Brief [183 KB] PMC-2050871 1 2005-05-06
    Data Sheet
          Version Issue Date
    Locked PDF Document TSE 120 ASSP Telecom Standard Product Data Sheet [2.53 MB] PMC-2042247 3 2007-01-02
    Application Note
          Version Issue Date
    Locked PDF Document Attaching Passive Heat Sinks to Organic Flip Chip Packages [142 KB] PMC-2020246 3 2007-05-02
    Locked Compressed Document Optimizing Pre-emphasis and Receive Equalization for Backplanes [493 kB] PMC-2021098 1 2002-10-31
    White Papers
          Version Issue Date
    Locked PDF Document Application of Message Assisted Protection Switching (MAPS) to APS Architectures [402 KB] PMC-2021902 3 2003-09-22
    Sales Collateral
          Version Issue Date
    Locked PDF Document Notice of Change - All FCBGA Packages to be Standardized to the HDBU Substrate Package Outline [695 KB] PMC-2062178 1 2006-10-19
    Symbols/Footprints
          Version Issue Date
    Locked Compressed Document PM5308 TSE 120 1152 FCBGA CAD Symbols and Footprints [590 KB] PMC-2050943 1 2005-05-16
    Technical Overview
          Version Issue Date
    Locked PDF Document RASIO 3G for SONET/SDH Backplanes Technology Brief [64 kB] PMC-2030933 1 2003-05-29